普通台面工艺制作新型超薄基区负阻HBT

Novel Ultra-Thin Base NDR HBT Fabricated by Common Mesa Process

  • 摘要: 负阻型HBT既保持了原HBT高频、高速的特点,同时又具有负阻、双稳、自锁等特性,是一种极具研究价值的新型负阻器件。该文从Early效应造成超薄基区穿通,器件由双极工作状态向体势垒管工作状态转变从而形成负阻特性的思路出发,通过对材料结构的特殊设计,采用普通台面工艺研制出了基区厚度为8 nm的负阻型HBT。该器件具有独特且显著的可变电压控制型负阻特性,其电流峰谷比大于1000,并伴有电流控制型负阻。

     

    Abstract: Negative Differential Resistance (NDR) Heterojunction Bipolar Transistor (HBT) holds high speed, high frequency characteristics of HBT and bistability, self-latching characteristics derived from NDR, is compatible with HBT manufacture technique, and has good research and application value. Based on the thought that Early effect causes very thin base reach-through, bipolar operation mode changes to barrier transistor operation mode and NDR appears, a novel 8 nm base NDR HBT has been fabricated through special design of device structure and common HBT mesa process, which has distinct and special variable voltage-controlled NDR characteristic and current-controlled NDR characteristic. The Peak to Valley Current Ratio(PVCR)voltage-controlled NDR character is higher than 1 000. All of phenomena are reported for the first time.

     

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