Abstract: In order to develop a bonding head mechanism with high-speed and high-precision characteristics and ensure the whole machine performance of automatic LED die bonders. A motion proposal and structure parameters of the head mechanism are designed, the motion modeling technologies and methods of the whole head mechanism are researched by using the Mechanism/Pro module of Pro/Engineer software, including mechanism modeling, driving control, and so on. The motion simulation of the whole head mechanism is executed, the simulation results are analyzed and show the feasibility and rationality of developed head mechanism, The head mechanism has been successfully used to the LED die bonding machine with desired functions and performances.