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Article Navigation >  Journal of University of Electronic Science and Technology of China  > 2009  >  38(5): 721-724

YUAN Zheng-xi, NI Qian-feng, YUAN Shi-tong, HE Wei. Study of PCB Bonding Finger Surface Discoloration[J]. Journal of University of Electronic Science and Technology of China, 2009, 38(5): 721-724. doi: 10.3969/j.issn.1001-0548.2009.05.035
Citation: YUAN Zheng-xi, NI Qian-feng, YUAN Shi-tong, HE Wei. Study of PCB Bonding Finger Surface Discoloration[J]. Journal of University of Electronic Science and Technology of China, 2009, 38(5): 721-724. doi: 10.3969/j.issn.1001-0548.2009.05.035
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Study of PCB Bonding Finger Surface Discoloration

doi: 10.3969/j.issn.1001-0548.2009.05.035
  • 1.

    School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China Chengdu 610054;

  • 2.

    School of Electronic Engineering,University of Electronic Science and Technology of China Chengdu 610054

  • Received Date: 2009-05-16
  • Publish Date: 2009-10-15
  • The phenomenon of printed circuit board (PCB) bonding finger surface discoloration was explained by analyzing the diffusion of copper atoms，that was, the copper atoms diffused from copper substrate to PCB bonding finger surface, then was oxidized. At the same time, the inherent driving force of copper atoms diffusion in the PCB bonding finger was analyzed. In addition, the diffusion flux and concentration distribution expressions of copper atoms in the PCB bonding finger were drawn by analyzing Fick's Law combined with actual conditions, which provided a theoretical basis for preventing diffusion of copper atoms in the PCB bonding finger.
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Study of PCB Bonding Finger Surface Discoloration

doi: 10.3969/j.issn.1001-0548.2009.05.035
  • 1. School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China Chengdu 610054;
  • 2. School of Electronic Engineering,University of Electronic Science and Technology of China Chengdu 610054
  • Received Date: 2009-05-16
  • Publish Date: 2009-10-15

Abstract: The phenomenon of printed circuit board (PCB) bonding finger surface discoloration was explained by analyzing the diffusion of copper atoms，that was, the copper atoms diffused from copper substrate to PCB bonding finger surface, then was oxidized. At the same time, the inherent driving force of copper atoms diffusion in the PCB bonding finger was analyzed. In addition, the diffusion flux and concentration distribution expressions of copper atoms in the PCB bonding finger were drawn by analyzing Fick's Law combined with actual conditions, which provided a theoretical basis for preventing diffusion of copper atoms in the PCB bonding finger.

YUAN Zheng-xi, NI Qian-feng, YUAN Shi-tong, HE Wei. Study of PCB Bonding Finger Surface Discoloration[J]. Journal of University of Electronic Science and Technology of China, 2009, 38(5): 721-724. doi: 10.3969/j.issn.1001-0548.2009.05.035
Citation: YUAN Zheng-xi, NI Qian-feng, YUAN Shi-tong, HE Wei. Study of PCB Bonding Finger Surface Discoloration[J]. Journal of University of Electronic Science and Technology of China, 2009, 38(5): 721-724. doi: 10.3969/j.issn.1001-0548.2009.05.035
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