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Article Navigation >  Journal of University of Electronic Science and Technology of China  > 2012  >  41(3): 392-396

TIAN Yu, TONG Ling, LI Hai-liang. Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(3): 392-396. doi: 10.3969/j.issn.1001-0548.2012.03.013
Citation: TIAN Yu, TONG Ling, LI Hai-liang. Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(3): 392-396. doi: 10.3969/j.issn.1001-0548.2012.03.013
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Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits

doi: 10.3969/j.issn.1001-0548.2012.03.013
  • 1.

    School of Automation Engineering,University of Electronic Science and Technology of China Chengdu 611731

  • Received Date: 2010-06-10
  • Rev Recd Date: 2010-09-27
  • Publish Date: 2012-06-15
  • The single through-via structure can be divided into two parts, interior structure and the exterior structure, based on physical modeling. The improved matrix-penciled moment method (MPMM) is applied to the analysis of the exterior structure. The equivalent circuit method which takes into account the parallel plate effect is applied to the analysis of the interior structure for structural features. The scattering parameters of the complete structure are obtained by the microwave network cascade theory. The hybrid analysis method is verified by comparing with the commercial simulation software HFSS in different boundary conditions. The computational efficiency of the hybrid analysis method is improved five times faster than that of the commercial simulation software benefitting from the combination of the field analysis method and the circuit analysis method.
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Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits

doi: 10.3969/j.issn.1001-0548.2012.03.013
  • 1. School of Automation Engineering,University of Electronic Science and Technology of China Chengdu 611731
  • Received Date: 2010-06-10
  • Rev Recd Date: 2010-09-27
  • Publish Date: 2012-06-15

Abstract: The single through-via structure can be divided into two parts, interior structure and the exterior structure, based on physical modeling. The improved matrix-penciled moment method (MPMM) is applied to the analysis of the exterior structure. The equivalent circuit method which takes into account the parallel plate effect is applied to the analysis of the interior structure for structural features. The scattering parameters of the complete structure are obtained by the microwave network cascade theory. The hybrid analysis method is verified by comparing with the commercial simulation software HFSS in different boundary conditions. The computational efficiency of the hybrid analysis method is improved five times faster than that of the commercial simulation software benefitting from the combination of the field analysis method and the circuit analysis method.

TIAN Yu, TONG Ling, LI Hai-liang. Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(3): 392-396. doi: 10.3969/j.issn.1001-0548.2012.03.013
Citation: TIAN Yu, TONG Ling, LI Hai-liang. Hybrid Analysis for Electromagnetic Characteristics of Through Vias in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(3): 392-396. doi: 10.3969/j.issn.1001-0548.2012.03.013
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