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CHEN Jian-jun, HUANG Ping, WANG Xiao-bing, CHEN Yong-qin. Thermal Effect Modelling of Intelligent Plate and Its Simulation[J]. Journal of University of Electronic Science and Technology of China, 2008, 37(6): 938-942.
Citation: CHEN Jian-jun, HUANG Ping, WANG Xiao-bing, CHEN Yong-qin. Thermal Effect Modelling of Intelligent Plate and Its Simulation[J]. Journal of University of Electronic Science and Technology of China, 2008, 37(6): 938-942.
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Thermal Effect Modelling of Intelligent Plate and Its Simulation

  • 1.

    School of Electronic and Mechanical Engineering,Xidian University Xi'an 710071

  • Received Date: 2007-05-11
  • Rev Recd Date: 2007-12-25
  • Publish Date: 2008-12-15
  • Thermal effects of piezoelectric intelligent plate are studied by finite element method. A finite element model including 4 displacement nodes, 2 electric potential nodes, and 8 temperature nodes is presented in this model. The displacement field is defined by plane shell element model; the electric potential field and temperature field are all defined by means of linear interpolation. The detailed element equations are deduced by using virtual work principle. The thermal influences on dynamic characteristics, displacement response, and output voltage are analyzed. The simulation of a intelligent cantilever plate shows that the thermal effect should be considered in the response analysis of intelligent plate.
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  • 1. 

    沈阳化工大学材料科学与工程学院 沈阳 110142

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Thermal Effect Modelling of Intelligent Plate and Its Simulation

  • 1. School of Electronic and Mechanical Engineering,Xidian University Xi'an 710071
  • Received Date: 2007-05-11
  • Rev Recd Date: 2007-12-25
  • Publish Date: 2008-12-15

Abstract: Thermal effects of piezoelectric intelligent plate are studied by finite element method. A finite element model including 4 displacement nodes, 2 electric potential nodes, and 8 temperature nodes is presented in this model. The displacement field is defined by plane shell element model; the electric potential field and temperature field are all defined by means of linear interpolation. The detailed element equations are deduced by using virtual work principle. The thermal influences on dynamic characteristics, displacement response, and output voltage are analyzed. The simulation of a intelligent cantilever plate shows that the thermal effect should be considered in the response analysis of intelligent plate.

CHEN Jian-jun, HUANG Ping, WANG Xiao-bing, CHEN Yong-qin. Thermal Effect Modelling of Intelligent Plate and Its Simulation[J]. Journal of University of Electronic Science and Technology of China, 2008, 37(6): 938-942.
Citation: CHEN Jian-jun, HUANG Ping, WANG Xiao-bing, CHEN Yong-qin. Thermal Effect Modelling of Intelligent Plate and Its Simulation[J]. Journal of University of Electronic Science and Technology of China, 2008, 37(6): 938-942.
shu

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