PCB金手指表面变色研究

基金项目:

粤港招标重大项目(H04010301W030784)

详细信息

Study of PCB Bonding Finger Surface Discoloration

1.
School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China Chengdu 610054;
2.
School of Electronic Engineering,University of Electronic Science and Technology of China Chengdu 610054

摘要: 对印制电路板(PCB)金手指表面变色进行研究,通过对铜原子扩散的分析,解释了PCB金手指表面变色的原因,即铜原子扩散到PCB金手指表面而被氧化;另外,通过分析铜原子在PCB金手指表面的扩散的内在驱动力,并利用菲克定律结合实际条件得出铜在PCB金手指表面的扩散流量和浓度分布表达式,为在实际运用中防止铜原子在PCB金手指表面的扩散提供了理论依据。
- 金手指 /
- 浓度分布 /
- 扩散流量 /
- 变色 /
- 印制电路板
Abstract: The phenomenon of printed circuit board (PCB) bonding finger surface discoloration was explained by analyzing the diffusion of copper atoms，that was, the copper atoms diffused from copper substrate to PCB bonding finger surface, then was oxidized. At the same time, the inherent driving force of copper atoms diffusion in the PCB bonding finger was analyzed. In addition, the diffusion flux and concentration distribution expressions of copper atoms in the PCB bonding finger were drawn by analyzing Fick's Law combined with actual conditions, which provided a theoretical basis for preventing diffusion of copper atoms in the PCB bonding finger.
- bonding finger /
- concentration distribution /
- diffusion flux /
- discoloration /
- PCB