TIAN Yu, TONG Ling. Research and Implementation of Characteristic Measurement for Via Holes in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(1): 60-64. DOI: 10.3969/j.issn.1001-0548.2012.01.012
Citation: TIAN Yu, TONG Ling. Research and Implementation of Characteristic Measurement for Via Holes in Microwave Multilayer Circuits[J]. Journal of University of Electronic Science and Technology of China, 2012, 41(1): 60-64. DOI: 10.3969/j.issn.1001-0548.2012.01.012

Research and Implementation of Characteristic Measurement for Via Holes in Microwave Multilayer Circuits

  • Considering the difficulty inherent in the measurement of via holes with vector network analyzer the measurement of via hole structures. The design of device under test, test fixture, test connection, boundary conditions, calibrations, and the de-embedding method are presented and experimented actually, the operating frequency covers from 10 MHz to 20 GHz. Comparison with former result, the advert side-effects caused by test connection and fixture has been removed, and furthermore, the more accurate characteristic of via holes can be acquired.
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