Case Study on Prognostics Technique Based on PoF to Predict Life of PCB

An efficient prognostics technique based on physics-of-failure is proposed to predict life of printed circuit board (PCB) in the ship-borne electronic products. By the case study of a PCB in typical ship-borne electronic products, the life prediction process of ship-borne PCB is presented. The typical life cycle environmental profile of the PCB is formed by considering three weak parts and the working environment of the PCB. After loading the environmental profile, the PCB life with its variation is obtained by the finite element analysis on temperature distribution and structural dynamic. In addition, two influencing factors Lair and RH from electromagnetic relays on the PCB life are analyzed in the models.