3D Unsteady Analysis of Temperature and Thermal Stress Fields of Resin Matrix Composite during Curing Process

A three-dimensional unsteady finite element analysis model is developed for the simulation of the temperature and thermal stress fields of the thermosetting resin matrix composite laminate during the curing process. The correctness of the numerical model and methodology is verified by comparing with the available experimental results. The distributions of temperature and thermal stress in 3234/T300 composite laminates during curing process are numerically predicted. The effects of the pre-curing time, heating rate and the stacking sequence on the temperature and thermal stress fields during curing process are analyzed. The numerical computation. results indicate that the temperature gradient and thermal stress in the laminates decrease with the increasing pre-curing time and decreasing heating rate. Using symmetrical stacking sequence can also decrease the temperature gradient and thermal stress in composite laminates.