Abstract: Recent years, microsystem has become one of the hot issues in electronic information field. This paper introduces a new three-dimensional integrated radio frequency (RF)-analog-digital microsystem. The architecture, process and verification of the microsystem are described in detail from the aspects of scheme and implementation. The traditional RF frontend is 250 mm × 120 mm size, while the microsystem is only 37 mm × 37 mm size, reducing its area by 95%. Based on the integrated ceramic three-dimensional package architecture, the microsystem integrates a variety of bare chips and passive devices to realize the electrical interconnection of internal signals. A new heat dissipation scheme is adopted to customize and develop a high thermal conductivity composite heat sink cover plate. The thermal conductivity is increased from 15 W/(m·K) to 150 W/(m·K) above. The thermal conductive silica gel is filled between the FC bare chip and the cover plate to form a new heat dissipation route and achieve efficient heat dissipation.