Abstract: To address the demand for high-performance and high-integrity electronic chips in high-performance computing, artificial intelligence, and unmanned systems, advanced packaging and integration technologies, represented by 2.5D and 3D integration of multi-chiplets, not only overcome the challenges of decreased yield and increased costs in current integrated chips but also serve as a crucial means for integrating multiple types and functions of chiplets. This paper summarizes the current state of research and technological advancements in 2.5D and 3D integration of multi-chiplets, including 2.5D integration using large-scale interposers, 3D stacking integration with high density, and glass-based integration. Based on this review, the major development directions and key technical challenges of 2.5D and 3D integration are explored. Next, the applications of 2.5D and 3D integration in digital, optoelectronic, and microelectromechanical integrated chips and devices are reviewed. Furthermore, the development and application directions of multi-chiplet integration technologies are summarized, providing developmental insights for the realization of miniaturized, multifunctional, integrated chips and systems.