LTCC接收前端组件的设计与实现
Design and Implementation of a LTCC-Based Receiver Front-End Module
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摘要: 低温共烧陶瓷(LTCC)多层基板技术是一种可实现微波电路小型化、高可靠性的新型技术。利用LTCC技术将功分器、耦合器、带通滤波器、电阻电容等接收前端主要无源元件埋置到基板内部,采用微组装技术实现芯片互连,实现了多芯片组装(MCM)级的S波段接收前端组件并进行了测试。测试结果表明接收前端达到设计指标,其体积仅相当于传统组件1/5。Abstract: Low temperature co-fired ceramic is a new technology for realizing microwave circuit with small size and high reliability. In this paper, using (LTCC) technology and micro-assembly technology, a receiver front-end in S-band is realized and tested. Results show that the receiver front-end realizes the design target. It has great advantages in volume and weight compared with traditional module when their circuit performance is equal.