AIN基片上重掺杂硼的多晶硅膜电阻率温度特性

Resistivity Temperature Characteristics of Polysilicon Films Heavily Doped With B on AIN Substrate

  • 摘要: 研究了AlN基片上重掺杂硼的多晶硅膜电阻率温度特性。实验发现,膜电阻率随温度变化呈现出从NTC过渡到PTC的U型特性,转折温度TM的位置依赖工艺条件的变化。理论分析表明:晶界势垒使膜电阻率在温度变化上存在一个极小值,极小值对应的转折温度正比于晶界势垒。

     

    Abstract: The resistivity-temperature characteristics of polysilicon films heavily doped with B, which is deposited on the AlN substrate are studied. It is found that the R-T characteristics show a U type curve within a wide temperature from 25℃~450℃, and the criterion depends on the processing techniques. The theroetical analysis shows that the minium of resistivity exists due to the interface barrier,and the result can be used to adjust the criterion and TCR.

     

/

返回文章
返回