工艺参数对Ta/Al合金电阻薄膜性能的影响
Effect of Technological Parameters on Performance of Ta/Al Alloy Resistive Films
-
摘要: Al原子含量约为50%的Ta/Al合金薄膜具有优良的电阻性能。使用直流共溅射的方法制作这种薄膜,靶极采用了Al面积为45%的Ta/Al复合靶。研究了工艺参数如溅射气压、溅射电压以及热处理条件等因素对该薄膜的性能影响。结果表明,这种Ta/Al合金薄膜能用于制作功率稳定的电阻器或电阻网络。Abstract: The Ta/Al alloy film containing Al 50% at.has an excellent resistive performance.The film is deposited by DC co-sputtering from tantalum cathode,45% of which is covered with area of aluminum discs.The influence of technological parameters such as sputtering pressure,sputtering voltage and heat-treatment conditions etc.on the properties of the film is explored.The results show that the Ta/Al alloy film can be used for stable power resistor or resistive network.