Abstract: The silicon microchannel in this paper is fabricated by laser process. The thin-film temperature sensors are integrated in the internal surface of microchannel by micro-machined technique. The heat dissipation performances of microchannel fabricated by laser process and deep reactive iron etching (DRIE) are experimentally tested respectively in different flow rates and heat fluxes. The experiment results represent that the rough internal surface of microchannel can effectively decrease the thermal resistance. Under the same condition, the thermal resistance can reduce by almost 50% when compared with the microchannel heat sink fabricated by DRIE. The temperature sensors integrated in microchannel can accurately capture temperature change in real time and reflect the temperature distribution in microchannel. It provides a new method to optimize the design of microchannel.