Abstract: Based on the comprehensive review and classification of the concepts, types, and realization processes of radio frequency/microwave power amplifier chips, this paper focus on the research status and urgent technical problems of key techniques such as high frequency, linearity improvement, energy conversion efficiency improvement, bandwidth expansion, highly integrated packaging and so on. The mainstream realization of each key technology, typical cases of research and development, as well as the advantages and disadvantages of the relevant applications, are also analyzed and discussed, targeting to summarize the methodology and provide design reference for the research and development of radio frequency front-end integrated power amplifier chips for modern wireless communication systems. Finally, the development trend and industry trend of radio frequency/microwave power amplifier chip technology are prospeted.