宽禁带功率半导体器件技术

Wide Bandgap Semiconductors for Power Electronics

  • 摘要: 碳化硅(SiC)和氮化镓(GaN)是第三代半导体材料的典型代表。与常规半导体硅(Si)和砷化镓(GaAs)相比,宽禁带半导体具有宽带隙、高饱和漂移速度、高临界击穿电场等突出优点,是大功率、高温、高频、抗辐照应用场合下极为理想的半导体材料。该文总结了宽禁带SiC和GaN功率半导体器件研发的最新进展,包括各种功率二极管和功率晶体管。同时对宽禁带SiC和GaN功率半导体器件发展所面临的市场和技术挑战进行了分析与概述,并对其发展前景进行了展望。

     

    Abstract: Wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), are considered to be excellent candidates for high power, high frequency and high temperature applications in the commercial and military power distribution and conversion systems. The advantages of wide bandgap materials over the conventional Si and GaAs include wide bandgap, high saturation electron velocity, and high critical electric field. In this paper, the recent progress in the development of high-voltage SiC and GaN power switching devices is reviewed. The experimental performance of various rectifiers and transistors, which have been demonstrated, is discussed. Market and technical challenges on SiC and GaN power devices are also described. The future trends in device development and commercialization are pointed out.

     

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