车载集群通信系统“自顶向下”电磁兼容设计

“Top-Down” Design Flow and Its Applications in Multi-VehicleCommunication System’s EMC Design

  • 摘要: 介绍了基于电子设计自动化(EDA)仿真的“自顶向下”的电子系统电磁兼容(EMC)设计流程,并将其应用于车载集群通信系统电磁兼容设计中。以某4辆装甲车构成的实际车载集群为例,针对其中的天线互扰、机箱泄漏和印刷电路板(PCB)辐射等各种电磁兼容问题,建立从系统级、设备级到PCB板级的分析流程,给出了相应的EDA分析和设计方法。工程实例表明,“自顶而下”的EMC设计能够有效地预测系统电磁干扰,提高系统电磁兼容水平。

     

    Abstract: The top-down electromagnetic compatibility (EMC) design flow and its applications inmulti-vehicle communication system, which is based on EDA software, are introduced. For the EMC problemssuch as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehiclecommunication system, the design flow from system level and device level to PCB level is present with simulationprocedure. The results show that this design flow can obviously improve the electromagnetic immunity of thesystem and make the design first pass success.

     

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