多产品半柔性并联生产线预防性维修调度模型研究

Research on Preventive Maintenance Scheduling Model for Multi-Products and Semi-Flexible Parallel Production Line

  • 摘要: 针对半导体芯片封装测试工厂多产品和半柔性并联生产线的预防性维修调度问题,提出了以生产时间最大化为目标函数,以多产品情况下生产线柔性限度、各产品所需的生产时间要求、预防性维修宽放区间、维修班组数量为约束的多产品半柔性并联生产线预防性维修调度的模型。将该模型应用于某芯片封装测试工厂的多产品半柔性并联生产线的预防性维修调度,在lingo9.0软件中建模并进行模型求解。调度结果已成功运用于实际生产,验证了该模型的可行性和准确性。

     

    Abstract: According to preventative maintenance scheduling for Multi-products and Semi-flexible Parallel Production Line (MSPPL) in semiconductor chipset assembly and test factories, the preventive maintenance scheduling model for MSPPL is proposed with the maximal production time as the objective function and under four constraints semi-flexible limits, multi-product production time requirements, preventive maintenance time windows, and the amount of preventive maintenance worker group. The proposed model has been applied in the multi-products and semi-flexible parallel production line of a chipset assembly and test factory by using the software named lingo (version is 9.0). The scheduling results have been successfully applied the actual production, which validates the feasibility and accuracy of the proposed model.

     

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