Abstract: Mechanical properties of Micro-USB electrical connectors is affected by instantaneous power on or off caused by hot-plugging. In order to further understand the failure behavior of electrical connectors under thermal cycling, it is necessary to carry out the fatigue life prediction for laser soldering joints of Micro-USB electrical connectors under heat acceleration test. Firstly, the finite element model of Micro-USB electrical connectors is established. The mechanical behavior of solder joints under cyclic thermal loading is described by using the Anand constitutive equation. Then, the stress or strain distribution is analyzed by means of ANSYS software. Finally, the thermal fatigue life under thermal cycling can be calculated by using the Coffin-Manson equation based on plastic strain. The results show that the maximum stress or strain occurs at the place of the middle solder joint contacting with metal Pin when laser soldering joints of electrical connectors are subjected to thermal cycling. Its fatigue life is lowest, only 1 146 times. Meanwhile, the risk of failure can be determined. The conclusions can provide a theoretical reference for the design, manufacture and testing of electrical connectors.